Intel has secured Tesla as a customer for its specialized module-level packaging services, signaling that billions of investments and years of development are appealing to external Foundry Customers. Tesla’s Dojo 3 initiative will see Samsung Electronics Foundry manufacture the custom D3 AI-training chips. At the same time, Intel handles the packaging and testing using its Embedded Multi-Die Interconnect Bridge (EMIB) technology, which connects multiple dies through silicon bridges rather than a full-wafer interposer. This dual-vendor approach diverges from Tesla’s previous reliance on TSMC for both fabrication and System-on-Chip packaging. Tesla CEO Elon Musk confirmed that Samsung will focus on mass-producing the next-generation AI6 chips on a 2 nm process, and that the packaging will leverage Intel’s EMIB platform. […]